Hua Hong prices IPO towards bottom

Chinese foundry manufacturer completes deal as Hong Kong equity markets stabilise.

Chinese foundry manufacturer Hua Hong Semiconductor priced its 228.7 million initial public offering towards the bottom end of its price range on Thursday. The Goldman Sachs-led deal raised HK$2.57 billion ($330 million) pre-greenshoe after pricing was fixed at HK$11.25.

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