MagnaChip launches roadshows for high yield bond

Korean semiconductor company hopes to raise $750 million from multi-tranche bond

MagnaChip Semiconductor, the non-memory arm recently sold by Hynix Semiconductor, has launched roadshows for a debut bond issue via lead managers Citigroup, JPMorgan and UBS. The deal has been structured to optimize the balance sheet of the company following its sale to a consortium of international private equity investors in October.

The deal comprises a $500 million senior secured issue, which has a 2011 maturity and both fixed and floating rate tranches, plus a $200 million senior subordinated tranche due 2014.

Ratings are about to be assigned and the company is expected to get a non-investment grade double-B rating below fellow foundry operators UMC...

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