TECH Semiconductor taps $400 million facility

Proceeds from the facility will be utilized for working capital and part refinancing of an existing facility.
September 17, 2002

TECH Semiconductor Singapore is paying a visit to the loan markets after two years with a $400 million facility. Mandated arrangers ABN AMRO, DBS Bank, OCBC and SSB/Citi have launched the facility into sub-underwriting earlier this week. The facility comprises of a $150 million revolving credit and a $250 million term loan.

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