Dealogic League Table Round-up Apr 6

Equity Capital Markets

Asia (ex-Japan) ECM volume stands at $1.1bn via eight deals so far this week (six IPOs and two follow-ons), compared to the $4.9bn via 20 deals completed in the previous week.

On April 3, Chinese issuer Sunwoda Electronic completed a $4.7m follow-on via Goldman Sachs and Dongxing Securities in what is the largest Asia (ex-Japan) ECM transaction this week and the fifth largest ECM transaction in Technology sector this YTD.

Asia (ex-Japan) Technology ECM volume stands at $17.0bn in 2018 YTD, up significantly from the $8.3bn raised in the same period last year. Follow-ons account for 90% of total volume with $15.3bn raised this YTD, with IPOs and convertibles being 8% ($1.4bn) and 2% ($364m) respectively.

Citi leads the ECM league table with $7.4bn this YTD, Goldman Sachs came in the second with $6.9bn, and Morgan Stanley follows this with $6.4bn.

Debt Capital Markets

Asian (ex-Japan) G3 DCM deals stands at $735m so far this week, halved from the $1.5bn raised last week.

This week’s only issuance from the region was a Basel III compliant EUR 600m bond issued by DBS Group Holdings Ltd via five bookrunners (DBS, Deutsche Bank, ING, Lloyds Banking Group, and SG Corporate & Investment Banking).

Asia (ex-Japan) Finance G3 DCM volume stands at $35.3bn so far this year, down from the $55.2bn raised in the same period last year. However, number of deals was slightly up from the 68 deals to 74 deals, indicating the decrease in the average deal size.

HSBC leads Asia (ex-Japan) G3 DCM league table in 2018 YTD with $6.5bn, Bank of China follows it with $4.39bn, and Citi comes in third with $4.35bn.