Big tech loan as Indian volumes continue to surge

Kingboard Laminates Holdings, Reliance Industries and Highwealth Construction feature in Dealogic's roundup of loans activity in Asia for March 31 to April 6.

By FinanceAsia & Dealogic

April 06, 2017

The second largest Technology sector deal signed in Asia Pacific ex Japan in 2017 YTD

Kingboard Laminates Holdings has signed a HK$6.0 billion facility through joint bookrunners and mandated lead arrangers Bank of China Hong Kong, Bank of China Macau, Bank of Tokyo-Mitsubishi UFJ, Chong Hing Bank, Hang Seng Bank, Industrial Commercial Bank of China Macau, Mizuho Bank, Standard Chartered Bank and Sumitomo Mitsui Banking Corp. Syndication saw China Construction Bank and OCBC Wing Hang Bank join in as mandated lead arrangers while Bank of East Asia, Industrial Commercial Bank of China Asia, Shanghai Commercial Savings Bank, Tai...

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