Equity Capital Markets
The Asian equity capital markets have raised $1.2 billion so far this week through 21 deals, down from the $7.6 billion raised in the same period last week.
Shenzhen Gas Corp’s $262 million A-share equity-linked deal through TF Securities and Guosen Securities was the largest deal of the week.
Equity-linked deal volume in the region has already reached $21.1 billion so far this year, the highest year-to-date level since 2010, which saw $26.9 billion worth of deals, and more than double the $10.4 billion raised in the same period last year. Chinese companies account for the majority of the issuance with $14.6 billion. This is the highest amount of equity-linked issuance out of China since 2010, when there were $15.4 billion of deals.
True Telecommunication Growth Infrastructure Fund is slated to complete a $1.9 billion IPO later today (December 20) through bookrunners Credit Suisse, Siam Commercial Bank, Bank of America Merrill Lynch and UBS. If completed successfully, the deal will be the second largest IPO from Southeast Asia in 2013.
In the league tables, the top three banks remain unchanged with Goldman Sachs topping the rankings on $17.2 billion, followed by UBS and JP Morgan.
Debt Capital Markets
Two issuers have tapped the Asian G3 debt capital markets for $753 million so far this week, which is almost on par with the $760 million raised last week.
The largest deal of the week was a $462 million bond by Micron Semiconductor through sole bookrunner JP Morgan.
The G3 bond volume from the Asian tech sector has reached $5.8 billion through 10 deals so far this year, the highest annual level on record and up from $3.1 billion through five deals in the same period last year.
HSBC continues to lead the league table rankings on $16.1 billion. The second and third spots are occupied by Deutsche Bank and Citi, respectively.
