Telekom Malaysia seeks debt financing

Telco issues RFP for a bridge financing and bond issue.

Telekom Malaysia sent out an RFP request for proposals this Monday seeking $300 million to $400 million in bridge financing ahead of a benchmark bond issue, likely to be launched early in the autumn. This marks the second RFP from the group, which had requested banks to submit proposals for a bond issue only a few weeks before.

Proceeds will be used to fund the group's prospective acquisition of an Indian cellular company, Idea. Telekom is...

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