Stats ChipPAC back in bonds

Singaporean test and assembly company takes advantage of strengthening credit markets.

Stats ChipPAC returned to the international bond markets for the second time in under a year on July 12 with a $150 million 144a deal via Credit Suisse First Boston. The Ba2BB rated credit's five-year bullet offering received an extremely strong market response in contrast to the most recent Asian high yield tech deal from the region by Hynix Semiconductor.

Backed by an order book of $1.2 billion, the lead was able to leverage...

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