The perpetual tier-1 bond issue by Julius Baer in mid-November marks the latest example of European banks seeking Asian investor support to secure cornerstone capital bond issues.
Unusual credit-enhanced deal from Korea kicks off the week's new issue calendar alongside the second three-year deal by an ICBC branch within the space of a month.
Three real estate loans were secured in Hong Kong this week, while Reliance locked up a massive $1.5 billion syndicate in India.
BEA tier-1 capital bond saves bank from a deteriorating capital base built on outdated standards.
Korea Development Bank's second three-year deal is priced with a coupon rate of 4.2%, in line with initial guidance. UOB, meanwhile, is poised to follow DBS with a covered bond.
The Hong Kong property group returns to the US dollar bond market with a seven-year offering.
Dealogic's weekly league table round-up of equity and debt capital market issuance.
Chinese property developer becomes the third company in as many weeks to access the international bond markets.
Singapore-listed wastewater treatment operator closes its order book early to cope with extremely strong private banking demand.
Australian real-estate loan volumes hit rock bottom this week, while Indonesian syndicated loans are down 37%, despite Charoen Pokphand Indonesia securing $320 mln.
The Chinese real estate developer raises Rmb1.5 billion via a three-year note, offering a coupon rate of 5.25%.
Two Singaporean borrowers from opposite ends of the credit spectrum access the international bond markets.
FinanceAsia's 4th Annual Borrowers & Investors Forum Southeast Asia was held on October 29 at the Marina Bay Sands in Singapore. With more than 300 attendees representing the top issuers and arrangers, the event featured lively debates on topics affecting capital markets in the region.
Swiss wealth manager completes the first AT1 issue by a foreign bank in Singapore dollars.
Busy day for Chinese investment grade issuers with deals from China Huarong Asset Management and China State Construction Engineering Corp.